Hernon Dissipator 746 can completely replace Loctite 384, this section is a thermal adhesive bonding the electronic component to the heat sink or printed circuit board thermal adhesive. Fast room temperature curing heat sensitive components with excellent heat dissipation combined with its ease of maintenance services can be controlled strength, perfect replaced the tape, epoxy adhesives, silicone, fasteners and mechanical clamps. Typical Applications Typical applications include transformers, transistors and other electronic components heat bonded to a printed circuit board assembly or heat sink.