Loctite 3513 is a one-component epoxy underfill resin serviceable for CSP (FBGA) and BGA. Cure rapidly heated. Excellent resistance to mechanical stress. Sufficiently low viscosity resin filling the bottom of the CSP and BGA. Consistent and defects can form at the bottom of the filling layer, the silicon chip can effectively reduce the overall between the substrate and the thermal expansion characteristics do not match or external impact. Rapid cure when heated. Lower viscosity characteristics make it better for underfill; higher liquidity strengthened its repair operability.