Dabond DB1120 encapsulant based single-component epoxy glue, IC bonding is the best accessory products. IC electronic crystals designed for bonding package to use, suitable for all kinds of electronic products, such as calculators, PDA, LCD, instrumentation. Which is characterized by moderate mobility, flow stability, easy dispensing molding. After curing flame retardant, anti-bending, low shrinkage, low moisture absorption and other characteristics, can provide effective protection for the IC. This encapsulant is designed after a long period of temperature / humidity / power and heat circulation, such as testing for the development of quality products. This section glue is specially designed to accommodate high-temperature lead-free processes encapsulant. Typical applications IC packaging, COB bonding