Dabond DB1300 This product is a one-component, low-temperature heat fast curing epoxy adhesive modified. At lower temperatures, within a very short time, in a variety of types of materials can form a great adhesive force between. Excellent product performance, a high storage stability. Typical applications of this product is suitable for low temperature curing processes, primarily used for bonding heat sensitive components for memory cards, CCD / CMOS and other devices. Note 1.Please used at room temperature, to prevent heat; 2. Products removed from the warehouse, to prevent an immediate opening, should be left at room temperature for at least 4 hours before opening and use (back to the time and packing size of the temperature, specific information Please consult your local supplier); 3. use to avoid direct contact, use gloves and other protective equipment; case of contact with skin, wash immediately; 4. adequate protection in the workplace ventilation. 5 For safety precautions for this product, consult the Material Safety Data Sheet (MSDS).