Dabond DB1400 is a single component epoxy sealant for CSP or BGA underfill processes. Consistent and defects can form at the bottom of the filling layer, the silicon chip can effectively reduce the overall between the substrate and the thermal expansion characteristics do not match or external impact. Rapid cure when heated. Lower viscosity characteristics make it better for underfill; higher liquidity strengthened its repair operability. Typical applications IC packaging, COB bonding