Dabond DB1220 is an epoxy resin (rapid thermal hardening) a binder, due to its viscosity and thixotropy, especially suitable for stencil printing dispensing process, and to obtain a good shape and effectively prevent the phenomenon of excess glue PCB board. It is according to the requirements of pollution-free products, developed into a high-temperature heat resistance requirements of lead-free (Pb-Free) welded on the applicable product. Typical applications prior to the reflow SMT components bonded to the printed circuit board. Particularly suitable for printing on the same board with a thickness varying heights glue points, high wet strength and high printing speed to suit the occasion.