Dabond DB1200 epoxy resin (rapid thermal hardening) binder, it has a high viscosity shear thinning characteristics, it is suitable for high-speed surface mount assembly machine (syringe) with a dispenser. For a variety of ultra-high-speed dispensing (45,000 ~ 50,000 DPH), which according to the requirements of pollution-free products, developed into a high-temperature heat resistance requirements of lead-free (Pb-Free) welded on the applicable product. Typical applications prior to the reflow SMT components bonded to the printed circuit board. Particularly suitable for heat-sensitive components requires low temperature curing adhesive or a fast curing needed occasions.